Identifying Defective Semiconductor Components on a Wafer Using Thermal Imaging

ABSTRACT

Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. Provisional PatentAppl. Nos. 61/355,226, filed Jun. 16, 2010, and 61/429,277, filed onJan. 3, 2011, each of which is incorporated herein by reference in itsentirety.

BACKGROUND

1. Field of Invention

The present invention relates generally to testing of semiconductorcomponents within a semiconductor wafer and specifically to wirelesstesting of the semiconductor components within the semiconductor wafersimultaneously and, optionally, measuring a performance of thesemiconductor components within the semiconductor wafer.

2. Related Art

A semiconductor device fabrication operation is commonly used tomanufacture components onto a semiconductor substrate to form asemiconductor wafer. The semiconductor device fabrication operation usesa predetermined sequence of photographic and/or chemical processingsteps to form components onto the semiconductor substrate. However,imperfections within the semiconductor wafer, such as imperfections ofthe semiconductor substrate, imperfections of the semiconductor devicefabrication operation, or imperfections in design of the componentsthemselves, may cause one or more of the semiconductor components tooperate differently than expected.

Conventional automatic test equipment (ATE) is commonly used to verifythat the semiconductor components within the semiconductor wafer operateas expected. The conventional automatic test equipment includes a fullcomplement of electronic testing probes to carry out a testingoperation. This full complement of electronic testing probes includeselectronic testing probes to apply power, digital testing signals,and/or analog testing signals to each of the semiconductor components toperform the testing operation. This full complement of electronictesting probes also includes electronic probes to read signals atvarious nodes of the semiconductor components to verify that each of thesemiconductor components operates as expected during the testingoperation.

Improvements in semiconductor device fabrication techniques have allowedthe manufacture of more complex semiconductor components, in greaterquantities, onto the semiconductor substrate requiring more electronicprobes to perform the testing operation. Typically, the electronicprobes are in direct contact with specially designated locations,commonly referred to as testing points, within the semiconductorcomponents. These more complex semiconductor components require moretesting points to perform the testing operation which occupy more realestate on the semiconductor substrate that could be allocated elsewhere.As a result, these improvements in semiconductor device fabrication haveled to an increase of the overall size and cost of the conventionalautomatic test equipment.

Thus, there is a need for automatic test equipment that verify thesemiconductor components within the semiconductor wafer operate asexpected that overcomes the shortcomings described above. Furtheraspects and advantages of the present invention will become apparentfrom the detailed description that follows.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES

Embodiments of the invention are described with reference to theaccompanying drawings. In the drawings, like reference numbers indicateidentical or functionally similar elements. Additionally, the left mostdigit(s) of a reference number identifies the drawing in which thereference number first appears.

FIG. 1 illustrates a first schematic block diagram of a wirelesscomponent testing environment according to a first exemplary embodimentof the present invention.

FIG. 2 illustrates a first schematic block diagram of a semiconductorcomponent according to a first exemplary embodiment of the presentinvention.

FIG. 3 illustrates a schematic block diagram of a first transmittermodule implemented as part of one of the semiconductor componentsaccording to a first exemplary embodiment of the present invention.

FIG. 4 illustrates a schematic block diagram of a first wirelessautomatic test equipment according to a first exemplary embodiment ofthe present invention.

FIG. 5A illustrates a first exemplary positioning of receiving antennasof the wireless automatic test equipment according to a first exemplaryembodiment.

FIG. 5B illustrates a second exemplary positioning of the receivingantennas of the wireless automatic test equipment according to a firstexemplary embodiment.

FIG. 5C illustrates a third exemplary positioning of the receivingantennas of the wireless automatic test equipment according to a firstexemplary embodiment.

FIG. 6 illustrates a schematic block diagram of a receiver moduleimplemented as part of the wireless automatic test equipment accordingto an exemplary embodiment of the present invention.

FIG. 7 graphically illustrates a first transmission field pattern ofmore than one of the semiconductor components according to an exemplaryembodiment of the present invention.

FIG. 8 illustrates a schematic block diagram of a second wirelesscomponent testing environment according to a second exemplary embodimentof the present invention.

FIG. 9 illustrates a schematic block diagram of a second semiconductorcomponent according to a first exemplary embodiment of the presentinvention.

FIG. 10 illustrates a schematic block diagram of a receiver moduleimplemented as part of the second exemplary semiconductor componentaccording to an exemplary embodiment of the present invention.

FIG. 11 illustrates a schematic block diagram of a second wirelessautomatic test equipment according to a first exemplary embodiment ofthe present invention.

FIG. 12 illustrates a schematic block diagram of a first transmittermodule implemented as part of the second wireless automatic testequipment according to a first exemplary embodiment of the presentinvention.

FIG. 13 is a flowchart of exemplary operational steps of a wirelessautomatic test equipment according to an exemplary embodiment of thepresent invention.

FIG. 14 illustrates a schematic block diagram of an integrated circuitunder test implemented as part of the first and/or the second exemplarysemiconductor components according to an exemplary embodiment of thepresent invention.

FIG. 15 illustrates a schematic block diagram of a thermal imagingmodule that may be implemented as part of the first or the secondexemplary wireless automatic test equipment according to an exemplaryembodiment of the present invention.

FIG. 16 illustrates a schematic block diagram of an optional performancemeasurement module implemented as part of the first or the secondexemplary wireless automatic test equipment according to an exemplaryembodiment of the present invention.

FIG. 17A illustrates an operation of a thermogram processor used in thesecond wireless automatic test equipment according to an exemplaryembodiment of the present invention.

FIG. 17B illustrates predetermined semiconductor component thermogramsaccording to an exemplary embodiment of the present invention.

FIG. 18 is a flowchart of exemplary operational steps of the secondwireless component testing environment according to an exemplaryembodiment of the present invention.

Embodiments of the invention will now be described with reference to theaccompanying drawings. In the drawings, like reference numbers generallyindicate identical, functionally similar, and/or structurally similarelements. The drawing in which an element first appears is indicated bythe leftmost digit(s) in the reference number.

DETAILED DESCRIPTION OF THE INVENTION

The following Detailed Description refers to accompanying drawings toillustrate exemplary embodiments consistent with the invention.References in the Detailed Description to “one exemplary embodiment,”“an exemplary embodiment,” “an example exemplary embodiment,” etc.,indicate that the exemplary embodiment described may include aparticular feature, structure, or characteristic, but every exemplaryembodiment may not necessarily include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same exemplary embodiment. Further, when a particularfeature, structure, or characteristic is described in connection with anexemplary embodiment, it is within the knowledge of those skilled in therelevant art(s) to effect such feature, structure, or characteristic inconnection with other exemplary embodiments whether or not explicitlydescribed.

The exemplary embodiments described herein are provided for illustrativepurposes, and are not limiting. Other exemplary embodiments arepossible, and modifications may be made to the exemplary embodimentswithin the spirit and scope of the invention. Therefore, the DetailedDescription is not meant to limit the invention. Rather, the scope ofthe invention is defined only in accordance with the following claimsand their equivalents.

The following Detailed Description of the exemplary embodiments will sofully reveal the general nature of the invention that others can, byapplying knowledge of those skilled in relevant art(s), readily modifyand/or adapt for various applications such exemplary embodiments,without undue experimentation, without departing from the spirit andscope of the present invention. Therefore, such adaptations andmodifications are intended to be within the meaning and plurality ofequivalents of the exemplary embodiments based upon the teaching andguidance presented herein. It is to be understood that the phraseologyor terminology herein is for the purpose of description and not oflimitation, such that the terminology or phraseology of the presentspecification is to be interpreted by those skilled in relevant art(s)in light of the teachings herein.

Embodiments of the invention may be implemented in hardware, firmware,software, or any combination thereof. Embodiments of the invention mayalso be implemented as instructions stored on a machine-readable medium,which may be read and executed by one or more processors. Amachine-readable medium may include any mechanism for storing ortransmitting information in a fotin readable by a machine (e.g., acomputing device). For example, a machine-readable medium may includeread only memory (ROM); random access memory (RAM); magnetic diskstorage media; optical storage media; flash memory devices; electrical,optical, acoustical or other forms of propagated signals (e.g., carrierwaves, infrared signals, digital signals, etc.), and others. Further,firmware, software, routines, instructions may be described herein asperforming certain actions. However, it should be appreciated that suchdescriptions are merely for convenience and that such actions in factresult from computing devices, processors, controllers, or other devicesexecuting the firmware, software, routines, instructions, etc.

First Exemplary Wireless Component Testing Environment

FIG. 1 illustrates a first schematic block diagram of a wirelesscomponent testing environment according to a first exemplary embodimentof the present invention. A semiconductor device fabrication operationis commonly used to manufacture components onto a semiconductorsubstrate to form a semiconductor wafer. The semiconductor devicefabrication operation uses a predetermined sequence of photographicand/or chemical processing steps to form the components onto thesemiconductor substrate. However, imperfections within the semiconductorwafer, such as imperfections of the semiconductor substrate,imperfections of the semiconductor device fabrication operation, orimperfections in design of the components themselves to provide someexamples, may cause one or more of the components to operate differentlythan expected.

A wireless testing environment 100 allows for simultaneous testing ofsemiconductor components 106.1 through 106.n, herein referred to as thesemiconductor components 106 by wireless automatic test equipment 104.The semiconductor components 106 represent any combination of electricalcomponents, such as any combination of active components, passivecomponents, or other suitable components that will be apparent to thoseskilled in the relevant art(s) to provide some examples, that areconfigured and arranged to form one or more integrated circuits. Thesemiconductor components 106 may be similar and/or dissimilar to eachother. The semiconductor substrate 108 represents a base that thesemiconductor device fabrication operation forms the semiconductorcomponents 106 onto. The semiconductor substrate 108 is typically a thinslice of semiconductor material, such as a silicon crystal, but mayinclude other materials, or combinations of materials, such as sapphireor any other suitable material that will be apparent to those skilled inthe relevant art(s) without departing from the spirit and scope of thepresent invention. The semiconductor wafer 102 represents thesemiconductor substrate 108 having the semiconductor components 106formed onto by the semiconductor device fabrication operation.

The wireless automatic test equipment 104 wirelessly tests one or moreof the semiconductor components 106 simultaneously to verify that theseone or more of the semiconductor components 106 operate as expected. Thewireless automatic test equipment 104 provides an initiate testingoperation signal 150 to the semiconductor components 106. The initiatetesting operation signal 150 represents a radio communication signalthat is wirelessly transmitted to the semiconductor components 106.

The initiate testing operation signal 150 is simultaneously observed byone or more of the semiconductor components 106. The semiconductorcomponents 106 that received the initiate testing operation signal 150enter into a testing mode of operation, whereby these semiconductorcomponents 106 execute a self-contained testing operation. Theself-contained testing operation may utilize a first set of parametersprovided by the initiate testing operation signal 150 to be used by afirst set of instructions that are stored within the semiconductorcomponents 106. Alternatively, the self-contained testing operation mayexecute a second set of instructions provided by the initiate testingoperation signal 150 and/or a second set of parameters to be used by thesecond set of instructions that are provided by the initiate testingoperation signal 150. In another alternate, the self-contained testingoperation may include any combination of the first set of instructions,the second set of instructions, the first set of parameters and/or thesecond set of parameters. The wireless automatic test equipment 104 mayprovide the initiate testing operation signal 150 during theself-contained testing operation to provide additional parameters and/orinstructions to the semiconductor components 106.

After completion of the self-contained testing operation, thesemiconductor components 106 wirelessly transmit testing operationoutcomes 152.1 through 152.n, herein testing operation outcomes 152, tothe wireless automatic test equipment 104 via a common communicationchannel 154. The common communication channel 154 represents acommunication channel that is be simultaneously utilized or shared bythe semiconductor components 106. Collectively, the semiconductorcomponents 106 communicate the testing operation outcomes 152 over thecommon communication channel 154 using a multiple access transmissionscheme. The multiple access transmission scheme may include any singlecarrier multiple access transmission scheme such as code divisionmultiple access (CDMA), frequency division multiple access (FDMA), timedivision multiple access (TDMA), and/or any other suitable singlecarrier multiple access scheme that will be apparent by those skilled inthe relevant art(s) without departing from the spirit and scope of thepresent invention. Alternatively, the multiple access transmissionscheme may include any multiple carrier multiple access transmissionscheme such as discrete multi-tone (DMT) modulation, orthogonalfrequency division multiplexing (OFDM), coded OFDM (COFDM), and/or anyother suitable multiple carrier multiple access scheme that will beapparent by those skilled in the relevant art(s) without departing fromthe spirit and scope of the present invention. In another alternate, themultiple access transmission scheme may include any combination of thesingle carrier multiple access transmission scheme and the multiplecarrier multiple access transmission scheme.

The wireless automatic test equipment 104 observes the testing operationoutcomes 152 as they pass through the common communication channel 154using one or more receiving antennas positioned in three-dimensionalspace. The wireless automatic test equipment 104 determines one or moresignal metrics, such as a mean, a total energy, an average power, a meansquare, an instantaneous power, a root mean square, a variance, a noun,a voltage level and/or any other suitable signal metric that will beapparent by those skilled in the relevant art(s) provide some examples,of the testing operation outcomes 152 as observed by the one or morereceiving antennas. The wireless automatic test equipment 104 uses theone or more signal metrics to map the testing operation outcomes 152 tothe semiconductor components 106. The wireless automatic test equipment104 determines a first group of semiconductor components from among thesemiconductor components 106 that operate as expected, and optionallytheir location within the semiconductor wafer 102, based upon thetesting operation outcomes 152 as observed by the one or more receivingantennas. Alternatively, the wireless automatic test equipment 104 maydetermine a second group of semiconductor components from among thesemiconductor components 106 that operate unexpectedly based upon thetesting operation outcomes 152 as observed by the one or more multiplereceiving antennas. The wireless automatic test equipment 104 may,optionally, provide a location of the second group of semiconductorcomponents within the semiconductor wafer 102. In another alternate, thewireless automatic test equipment 104 may determine any combination ofthe first group of semiconductor components and the second group ofsemiconductor components and, optionally, provide their correspondinglocations within the semiconductor wafer 102.

First Exemplary Semiconductor Component

FIG. 2 illustrates a first schematic block diagram of a semiconductorcomponent according to a first exemplary embodiment of the presentinvention. A semiconductor component 200 observes the initiate testingoperation signal 150 from the wireless automatic test equipment 104. Thesemiconductor component 200 represents an exemplary embodiment of one ofthe semiconductor components 106. The semiconductor component 200performs the self-contained testing operation in response to receivingthe initiate testing operation signal 150. After completion of theself-contained testing operation, the semiconductor component 200wirelessly transmits an individual testing operation outcome 250 of theself-contained testing operation. The individual testing operationoutcome 250 represents an exemplary embodiment of one of the testingoperation outcomes 152.

The semiconductor component 200 includes a transceiver module 202, anintegrated circuit under test 204, and a testing module 206. Thetransceiver module 202 provides an initiate test control signal 252based upon the initiate testing operation signal 150 and the individualtesting operation outcome 250 based upon an indication of operability254. More specifically, the transceiver module 202 includes a receivermodule 208 and a transmitter module 210. The receiver module 208downconverts, demodulates, and/or decodes the initiate testing operationsignal 150 to provide the initiate test control signal 252. Similarly,the transmitter module 210 encodes, modulates, and/or upconverts theindication of operability 254 in accordance with the multiple accesstransmission scheme, as discussed above, to provide the individualtesting operation outcome 250.

Exemplary Transmitter Module Implemented as Part of the First ExemplarySemiconductor Component

FIG. 3 illustrates a schematic block diagram of a first transmittermodule implemented as part of one of the semiconductor componentsaccording to a first exemplary embodiment of the present invention. Atransmitter module 300 encodes, modulates, and/or upconverts theindication of operability 254 to provide the individual testingoperation outcome 250 in accordance with the multiple accesstransmission scheme, as discussed above. The transmitter module 300represents an exemplary embodiment of the transmitter module 210.

The transmitter module 300 includes an encoding module 302, a modulatingmodule 308, and an upconverter module 310. The encoding module 302encodes the indication of operability 254 in accordance with themultiple access transmission scheme to provide an encoded indication ofoperability 350. In an exemplary embodiment, the encoding module 302encodes the indication of operability 254 in accordance with a codedivision multiple access (CDMA) scheme. In this exemplary embodiment,the encoding module 302 includes a spreading code generator 304 and aspreading module 306. The spreading code generator 304 provides a uniquerandom, pseudo-random, and/or non-random sequence of data, referred toas a spreading code 352, to the spreading module 306. The spreading code352 represents to a sequence of bits that is unique to each of thesemiconductor components 106, or groups of the semiconductor components106, to encode the indication of operability 254. The spreading module306 utilizes the spreading code 352 to encode the indication ofoperability 254 to provide the spreaded indication of operability 350.

The modulating module 308 modulates the spreaded indication ofoperability 350 using any suitable analog or digital modulationtechniques such as amplitude modulation (AM), frequency modulation (FM),phase modulation (PM), phase shift keying (PSK), frequency shift keying(FSK), amplitude shift keying (ASK), quadrature amplitude modulation(QAM) and/or any other suitable modulation technique that will beapparent to those skilled in the relevant art(s) to provide a modulatedindication of operability 354.

The upconverter module 310 frequency translates or upconverts themodulated indication of operability 354 to provide the individualtesting operation outcome 250. More specifically, the upconverter module310 may upcovert the individual testing operation outcome 250 using asingle carrier frequency and/or among multiple carriers to implement themultiple access transmission to provide the individual testing operationoutcome 250. In an exemplary embodiment, the upconverter module 310 isoptional. In this exemplary embodiment, the modulating module 308directly provides the modulated indication of operability 354 as theindividual testing operation outcome 250.

Referring again to FIG. 2, the testing module 206 provides theself-contained testing operation 256 in response to the initiate testcontrol signal 252. The self-contained testing operation 256 may utilizea first set of parameters provided by the initiate testing operationsignal 150 to be used by a first set of instructions that are storedwithin the testing module 206. Alternatively, the self-contained testingoperation 256 may execute a second set of instructions provided by theinitiate testing operation signal 150 and/or a second set of parametersto be used by the second set of instructions that are provided by theinitiate testing operation signal 150. In another alternate, theself-contained testing operation 256 may include any combination of thefirst set of instructions, the second set of instructions, the first setof parameters and/or the second set of parameters.

The initiate test control signal 252 causes the testing module 206 toenter into a testing mode of operation. In the testing mode ofoperation, the testing module 206 may load the first set of instructionsand/or the first set of parameters of the self-contained testingoperation 256 from one or more memory devices. The testing module 206may provide the first set of instructions and/or the first set ofparameters individually, or as a group, to the integrated circuit undertest 204 as the testing routine 256. Alternatively, the testing module206 may gather the second set of instructions and/or the second set ofparameters of the self-contained testing operation 256 from theself-contained testing operation 252. The testing module 206 may providethe second set of instructions and/or the second set of parametersindividually, or as a group, to the integrated circuit under test 204 asthe testing routine 256. Alternatively, the testing module 206 mayprovide any combination of the first and the second set of instructionsand/or the first and the second set of parameters to the integratedcircuit under test 204 as the testing routine 256

The integrated circuit under test 204 executes the self-containedtesting operation 256 to determine whether the integrated circuit undertest 204 operates as expected. The integrated circuit under test 204provides an indication of operability 258 during and/or after executionof the self-contained testing operation 256 to the testing module 206.The indication of operability 258 indicates whether the integratedcircuit under test 204 operates as expected or, alternatively, whetherthe integrated circuit under test 204 operates unexpectedly and,optionally, one or more locations within the integrated circuit undertest 204 that operate unexpectedly.

The testing module 206 may additionally analyze the indication ofoperability 258, format the indication of operability 258 by appending aunique identification number of the semiconductor component 200 to theindication of operability 258, or by formatting the indication ofoperability 258 according to a known communications standard to providesome examples, and/or encode the indication of operability 258 using anysuitable error correction coding such as a block code, a convolutionalcode, and/or any other suitable error correction coding scheme that willbe apparent to those skilled in the relevant art(s), before providingthe indication of operability 254 to the transceiver module 202. In anexemplary embodiment, the testing module 206 includes a random numbergenerator to generate the unique identification number. However, thisexemplary embodiment is not limiting, those skilled in the relevantart(s) will recognize that other methods may be used to generate theunique identification number without departing from the spirit and scopeof the present invention. For example, the unique identification numbermay be generated by wireless automatic test equipment 104 and providedto the semiconductor component 200 using a direct current (DC) probe forstorage into a memory device, such as any suitable non-volatile memory,any suitable volatile memory, or any combination of non-volatile andvolatile memory that will be apparent to those skilled in the relevantart(s).

In an exemplary embodiment, the testing module 206 only provides theindication of operability 254 to the transceiver module 202 when theindication of operability 258 indicates the integrated circuit undertest 204 operates as expected. In this situation, the transceiver module202 does not provide the individual testing operation outcome 250 whenthe integrated circuit under test 204 operates unexpectedly.Alternatively, the testing module 206 only provides the indication ofoperability 254 to the transceiver module 202 when the indication ofoperability 258 indicates the integrated circuit under test 204 operatesunexpectedly. In this situation, the transceiver module 202 does notprovide the individual testing operation outcome 250 when the integratedcircuit under test 204 operates as expected.

First Exemplary Wireless Automatic Test Equipment

FIG. 4 illustrates a schematic block diagram of a first wirelessautomatic test equipment according to a first exemplary embodiment ofthe present invention. The semiconductor components 106 transmit thetesting operation outcomes 152 to the wireless automatic test equipment400 via the common communication channel 154. The wireless automatictest equipment 400 includes one or more receiving antennas to observethe testing operation outcomes 152 from one or more directions in threedimensional space. The wireless automatic test equipment 400 maydetermine whether one or more of the semiconductor components 106operate as expected and, optionally, may use properties of the threedimensional space, such as distance between each of multiple receivingantennas and/or the semiconductor components 106 to provide an example,to determine a location of the one or more of the semiconductorcomponents 106 within the semiconductor wafer 102. The wirelessautomatic test equipment 400 represents an exemplary embodiment of thewireless automatic test equipment 104.

The wireless automatic test equipment 400 includes receiving antennas402.1 through 402.i, a receiver module 404, a metric measurement module406, a testing processor 408, an operator interface module 410, atransmitter module 412, and a transmitting antenna 414. The receivingantennas 402.1 through 402.i, herein referred to as the receivingantennas 402, are positioned at corresponding positions in the threedimensional space. In an exemplary embodiment, the receiving antennas402 include two receiving antennas, namely a first receiving antenna402.1 and a second receiving antenna 402.2. In this exemplaryembodiment, the first receiving antenna 402.1 and the second receivingantenna 402.2 are placed at a distance of d₁ and d₂, correspondingly,from a center of the semiconductor wafer 102, the distance d₁ and thedistance d₂ being similar to or dissimilar from each other. In thisexemplary embodiment, the first receiving antenna 402.1 is separatedfrom the second receiving antenna 402.2 by an angle θ, such as ninetydegrees to provide an example.

First Exemplary Positioning of Receiving Antennas of the WirelessAutomatic Test Equipment

FIG. 5A illustrates a first exemplary positioning of receiving antennasof the wireless automatic test equipment according to a first exemplaryembodiment. As shown in FIG. 5A, the receiving antennas 402 may beplaced along a radius r of a spherical shell 502 in the threedimensional space proximate to the semiconductor wafer 102. In anexemplary embodiment, the receiving antennas 402 may form corners of apolygon that is positioned within a plane that intersects the sphericalshell 502. The polygon may be characterized as having sides of similaror dissimilar length. However, this example is not limiting, thoseskilled in the relevant art(s) will recognize that the receivingantennas 402 may be placed along any suitable radius r in one or moreplanes that intersect the spherical shell 502 without departing from thesprit and scope of the present invention.

Second Exemplary Positioning of the Receiving Antennas of the WirelessAutomatic Test Equipment

FIG. 5B illustrates a second exemplary positioning of the receivingantennas of the wireless automatic test equipment according to a firstexemplary embodiment. The receiving antennas 402 may be placed along acorresponding radius r₁ through r₁ of a corresponding spherical shell504.1 through 504.i in the three dimensional space proximate to thesemiconductor wafer 102. For example, the receiving antenna 402.1 may beplaced along a radius r₁ of a first spherical shell 504.1 in the threedimensional space. Likewise, the receiving antenna 402.i may be placedalong a radius r_(n) of an i^(th) spherical shell 504.i in the threedimensional space. A radius having a greater subscript may be greaterthan, less than, or equal to a radius having a lesser subscript. Forexample, the radius r^(n) may be greater than, less than, or equal tothe radius r₁.

Although FIG. 5A and FIG. 5B illustrate positioning of the receivingantennas 402 in relation to a spherical shell, those skilled in therelevant art(s) will recognize that any other regular geometricstructure, irregular geometric structure, open structure, closestructure, or any combination thereof may be used to position thereceiving antennas 402 in the three dimensional space without departingfrom the spirit and scope of the present invention.

Third Exemplary Positioning of the Receiving Antennas of the WirelessAutomatic Test Equipment

FIG. 5C illustrates a third exemplary positioning of the receivingantennas of the wireless automatic test equipment according to a firstexemplary embodiment. Each of the receiving antennas 402 may bepositioned anywhere along a geometric structure 506 in the threedimensional space proximate to the semiconductor wafer 102. Thegeometric structure 506 may represent an irregular geometric structure,as shown, or any regular geometric structure that will be apparent tothose skilled in the relevant art(s). Additionally, the geometricstructure 506 may represent a closed structure, as shown, or any openstructure that will be apparent to those skilled in the relevant art(s).

Referring again to FIG. 4, the receiving antennas 402 observe testingoperation outcomes 452.1 through 452.i, herein testing operationoutcomes 452, to provide one or more observed testing operation outcomes454.1 through 454.i, herein observed testing operation outcomes 454. Thetesting operation outcomes 452 represent the testing operation outcomes152 as they propagate through the common communication channel 154 asobserved by the receiving antennas 402 at their corresponding positionsin the three-dimensional space. For example, the observed testingoperation outcome 454.1 represents the testing operation outcomes 152 asthey propagate through the common communication channel 154 as observedby the receiving antenna 402.1 at a first position in thethree-dimensional space. Likewise, the observed testing operationoutcome 454.2 represents the testing operation outcomes 152 as theypropagate through the common communication channel 154 as observed bythe receiving antenna 402.2 at a second corresponding position in thethree-dimensional space.

The receiver module 404 downconverts, demodulates, and/or decodes theobserved testing operation outcomes 454 to provide recovered testingoutcomes 456.1 through 456.k, herein recovered testing outcomes 456, inaccordance with the multiple access transmission scheme, as discussedabove. More specifically, the wireless automatic test equipment 400includes i receiving antennas 402 to observe the testing operationoutcomes 152 as they propagate through the common communication channel154 to provide observed testing operation outcomes 454. Each of theobserved testing operation outcomes 454 includes the testing operationoutcomes 152 as observed by its corresponding receiving antenna 402. Forexample, the observed testing operation outcomes 454.1 includes thetesting operation outcomes 152 as observed the receiving antenna 402.1and the observed testing operation outcomes 454.i includes the testingoperation outcomes 152 as observed the receiving antenna 402.i.

The receiver module 404 downconverts, demodulates, and/or decodes theobserved testing operation outcomes 454 to provide a correspondingrecovered testing outcome 456 for each of the n testing operationoutcomes 152 for each of the i testing operation outcomes 454 for atotal of n*i=k recovered testing outcomes 456. In other words, thereceiver module 404 downconverts, demodulates, and/or decodes each ofthe testing operation outcomes 454 as observed by each of the receivingantennas 402. In an exemplary embodiment, the testing operation outcome456.1 represents the testing operation outcome 152.1 as observed by thereceiving antenna 402.1, the testing operation outcome 456.2 representsthe testing operation outcome 152.2 as observed by the receiving antenna402.1. In this exemplary embodiment, the testing operation outcome 456.krepresents the testing operation outcome 152.n as observed by thereceiving antenna 402.i.

Exemplary Receiver Module Implemented as Part of the Wireless AutomaticTest Equipment

FIG. 6 illustrates a schematic block diagram of a receiver moduleimplemented as part of the wireless automatic test equipment accordingto an exemplary embodiment of the present invention. A receiver module600 downconverts, demodulates, and/or decodes the observed testingoperation outcomes 454 to provide the recovered testing outcomes 456 inaccordance with the multiple carrier access transmission scheme. Thereceiver module 600 represents an exemplary embodiment of the receivermodule 404.

The receiver module 600 includes a downconverter module 602, ademodulating module 604, and a decoding module 606. The downconvertermodule 602 frequency translates or downconverts the observed testingoperation outcomes 454 to a baseband frequency or an intermediatefrequency (IF) to provide downconverted testing operation outcomes 652.1through 652.i, herein downconverted testing operation outcomes 652. Morespecifically, the downconverter module 602 may downconvert the observedtesting operation outcomes 454 using a single carrier frequency toimplement the single carrier multiple access transmission scheme oramong multiple carriers to implement the multiple carrier multipleaccess transmission scheme to provide the downconverted testingoperation outcomes 652. In an exemplary embodiment, the downconvertermodule 602 is optional. In this exemplary embodiment, the demodulatingmodule 604 directly observes the observed testing operation outcomes454.

The demodulating module 604 demodulates the downconverted testingoperation outcomes 652 using any suitable analog or digital demodulationtechnique for any suitable modulation technique such as amplitudemodulation (AM), frequency modulation (FM), phase modulation (PM), phaseshift keying (PSK), frequency shift keying (FSK), amplitude shift keying(ASK), quadrature amplitude modulation (QAM) and/or any other suitablemodulation technique that will be apparent to those skilled in therelevant art(s) to provide demodulated testing operation outcomes 654.1through 654.i, herein demodulated testing operation outcomes 654.

The decoding module 606 decodes the demodulated testing operationoutcomes 654 using any suitable multiple access transmission scheme toprovide the recovered testing outcomes 456. In an exemplary embodiment,the decoding module 606 decodes the demodulated testing operationoutcomes 654 in accordance with a code division multiple access (CDMA)scheme. In this exemplary embodiment, the decoding module 606 includes adespreading code generator 608 and a despreading module 610. Thedespreading code generator 608 provides unique random, pseudo-random,and/or non-random sequences of data, referred to as despreading codes656.1 through 656.n, to the despreading module 610. Each of thedespreading codes 656.1 through 656.n represent a corresponding one ofthe spreading codes that were used to by the semiconductor components106 to provide their corresponding testing operation outcome 152. Forexample, the despreading code 656.1 represents the spreading code usedby the semiconductor component 106.1 to provide the testing operationoutcome 152.1. The despreading code module 610 utilizes the despreadingcodes 656.1 through 656.n to decode the demodulated testing operationoutcomes 654 to provide a total of n*i=k recovered testing outcomes 456.

Referring again to FIG. 4, the metric measurement module 406 determinesone or more signal metrics of the recovered testing outcomes 456 toprovide measured signal metrics 458.1 through 458.k, herein measuredsignal metrics 458. The one or more signal metrics may include a mean, atotal energy, an average power, a mean square, an instantaneous power, aroot mean square, a variance, a norm, a voltage level and/or any othersuitable signal metric of the recovered testing outcomes 456 that willbe apparent by those skilled in the relevant art(s) without departingfrom the spirit and scope of the present invention.

The testing processor 408 may determine a first group of semiconductorcomponents from among the semiconductor components 106 that operate asexpected based upon the recovered testing outcomes 456. The testingprocessor 408 evaluates the recovered testing outcomes 456 for each ofthe unique identification numbers to determine whether its correspondingsemiconductor component 106 is part of the first group of semiconductorcomponents. Alternatively, the testing processor 408 may determine thefirst group of semiconductor components based upon the recovered testingoutcomes 456.1 through 456.i that correspond to the first receivingantenna 402.1, based upon the recovered testing outcomes 456.(k−i)through 456.k that correspond to the receiving antenna 402.i, or anysuitable combination of antennas that will be apparent to those skilledin the relevant art(s) without departing from the spirit and scope ofthe present invention. Alternatively, the testing processor 408 maydetermine a second group of semiconductor components from among thesemiconductor components 106 that operate unexpectedly based upon therecovered testing outcomes 456. In another alternate, the testingprocessor 408 may determine any combination of the first group ofsemiconductor components and the second group of semiconductorcomponents.

In an exemplary embodiment, the testing processor 408 may provide thetesting operation command signal 464 to the transmitter module 412 thatcauses the transmitter module 412 to provide the initiate testingoperation signal 466 that causes those semiconductor components 106 thatoperate as expected to enter into a transmitting state and thosesemiconductor components 106 that operate unexpectedly to enter into anon-transmitting state. Alternatively, the testing processor 408 mayprovide the testing operation command signal 464 to the transmittermodule 412 that causes the transmitter module 412 to provide theinitiate testing operation signal 466 that causes those semiconductorcomponents 106 that operate unexpectedly to enter into a transmittingstate and those semiconductor components 106 that operate as expected toenter into a non-transmitting state. In these exemplary embodiments,only those semiconductor components 106 that are in the transmittingstate provide their respective testing operation outcome 152.

The testing processor 408 may, optionally, determine a location of thesemiconductor components 106 within the semiconductor wafer 102 basedupon the measured signal metrics 458. The testing processor 408 maydetermine the location of each of the semiconductor components 106,those semiconductor components 106 in the transmitting state, thosesemiconductor components 106 in the non-transmitting state, and/or anycombination thereof.

First Exemplary Mapping of the Testing Operation Outcomes

FIG. 7 graphically illustrates a first transmission field pattern 700 ofmore than one of the semiconductor components according to an exemplaryembodiment of the present invention. As discussed above, thesemiconductor components 106 communicate the testing operation outcomes152 over the common communication channel 154 to the wireless automatictest equipment 400.

A first semiconductor component 702.1 transmits a first testingoperation outcome 752.1 using a first antenna, such as a dipole antenna,over the common communication channel 154 in accordance with themultiple access scheme. However this example is not limiting, thoseskilled in the relevant art(s) will recognize that other types ofantenna such as a random wire antenna, a horn, a parabolic antenna, apatch antenna, or any other suitable antenna that is capable ofconverting an electromagnetic wave into a current to provide someexamples, or combinations of antenna may be utilized by the firstsemiconductor component 702.1. The first testing operation outcome 752.1propagates through the common communication channel 154 to a firstreceiving antenna 402.1 and a second receiving antenna 402.2 asillustrated by a first field pattern 704.1. Those skilled in therelevant art(s) will recognize that more receiving antennas 402 may beutilized, as shown in FIG. 5A through 5C, without departing from thespirit and scope of the present invention.

Likewise, a second semiconductor component 702.2 substantiallysimultaneously transmits a second testing operation outcome 752.2 usinga second antenna over the common communication channel 154 in accordancewith the multiple access scheme. The second testing operation outcome752.2 propagates through the common communication channel 154 to thefirst receiving antenna 402.1 and the second receiving antenna 402.2 asillustrated by a second field pattern 704.2.

The first semiconductor component 702.1 and the second semiconductorcomponent 702.2 represent exemplary embodiments of any two of thesemiconductor components 106. Likewise, the first testing operationoutcome 752.1 and the second testing operation outcome 752.2 representexemplary embodiments of any two of the testing operation outcomes 152.

Placement of the first receiving antenna 402.1 at a distance d₁ from thesemiconductor wafer 102 in the three dimensional space and the secondreceiving antenna 402.2 at a distance d₂ in the three dimensional spacefrom the semiconductor wafer 102 allows the wireless automatic testequipment 400 to determine that the first testing operation outcome752.1 is being provided by the first semiconductor component 702.1 andthe second testing operation outcome 752.2 is being provided by thesecond semiconductor component 702.2. More specifically, the one or moresignal metrics of the first testing operation outcome 752.1 and thesecond testing operation outcome 752.2 deviate as they propagate throughthe common communication channel 154. For example, the first testingoperation outcome 752.1 and the second testing operation outcome 752.2as observed by the first receiving antenna 402.1 will be substantiallysimilar since the first semiconductor component 702.1 and the secondsemiconductor component 702.2 are substantially equidistant from thefirst receiving antenna 402.1. As a result, the one or more signalmetrics of the first testing operation outcome 752.1 and the one or moresignal metrics of the second testing operation outcome 752.2 will besubstantially similar allowing the wireless automatic test equipment 400to determine that the first semiconductor component 702.1 and the secondsemiconductor component 702.2 are equidistant from the first receivingantenna 402.1.

However, the first testing operation outcome 752.1 and the secondtesting operation outcome 752.2 as observed by the second receivingantenna 402.2 will not be substantially similar since the firstsemiconductor component 702.1 and the second semiconductor component702.2 are not equidistant from the second receiving antenna 402.2. Forexample, the one or more signal metrics of the first testing operationoutcome 752.1 along the radius r₁ are less than the one or more signalmetrics of the second testing operation outcome 752.2 along the radiusr₂. As a result, the one or more signal metrics of the first testingoperation outcome 752.1 and the one or more signal metrics of the secondtesting operation outcome 752.2 will differ allowing the wirelessautomatic test equipment 400 to determine that the first semiconductorcomponent 702.1 and the second semiconductor component 702.2 are notequidistant from the second receiving antenna 402.2. Rather, the firstsemiconductor component 702.1 is farther away from the second receivingantenna 402.2 when compared to the second semiconductor component 702.2.

Referring again to FIG. 4, the testing processor 408 assigns therecovered testing outcomes 456 to corresponding coordinates from among isets of coordinates in the three dimensional space to determine thelocation of the semiconductor components 106 within the semiconductorwafer 102. For example, in an embodiment of the wireless automatic testequipment 400 having a first receiving antenna 402.1 and a secondreceiving antenna 402.2, the first receiving antenna 402.1 and thesecond receiving antenna 402.2 observe the testing operation outcome452.1 and the testing operation outcome 452.2, correspondingly. In thisexample, the testing processor 408 designates the measured signalmetrics 458.1 and 458.i that correspond to the first receiving antenna402.1 as a first coordinate for each of the i sets of coordinates in thethree dimensional space. Similarly, the testing processor 408 designatesthe measured signal metrics 458.(i+1) and 458.k that correspond to thesecond receiving antenna 402.2 as a second coordinate for each of the isets of coordinates in the three dimensional space.

The testing processor 408 extracts the unique identification number foreach of the semiconductor components 106 from the recovered testingoutcomes 456, or a subset of, from the recovered testing outcomes 456,such as the recovered testing outcomes 456.1 through 456.i to provide anexample. The testing processor 408 assigns the unique identificationnumber for each of the semiconductor components 106 that is embeddedwithin the testing operation outcomes 452 to the i sets of coordinates.

The testing processor 408 maps the unique identification numbers totheir corresponding semiconductor component 106 to determine thelocation of the semiconductor components 106 within the semiconductorwafer 102. The testing processor 408 may determine the location of thesemiconductor components 106 within the semiconductor wafer 102 bycomparing the measured signal metrics 458 corresponding to each of theunique identification number to predetermined signal metrics for each ofthe semiconductor components 106. The predetermined signal metricsrepresent expected values of the measured signal metrics 458. Forexample, one or more predetermined signal metrics, or range of signalmetrics, for each of the semiconductor components 106 are determinedprior to the testing operation. The testing processor 408 may comparethe i sets of coordinates for the unique identification numbers to theone or more predetermined signal metric for each of the semiconductorcomponents 106 to effectively map the unique identification numbers tothe semiconductor components 106. Alternatively, the testing processor408 may iteratively interpolate the location of the uniqueidentification numbers to the semiconductor components 106 within thesemiconductor wafer 102 based upon relationships between theircorresponding measured signal metrics 458. For example, if a firstcoordinate from among a first set of coordinates that is assigned to afirst unique identification number is greater than a first coordinatefrom among a second set of coordinates that is assigned to a secondunique number, then the semiconductor component 106 that provided thefirst unique identification number is closer to the first receivingantenna 402.1 when compared to the semiconductor component 106 thatprovided the second unique number. As another example, if the firstcoordinate from among the first set of coordinates is less than a firstcoordinate from among a third set of coordinates that is assigned to athird unique identification number, then the semiconductor component 106that provided the first unique identification number is further from thefirst receiving antenna 402.1 when compared to the semiconductorcomponent 106 that provided the third unique identification number.

The testing processor 408 may provide a listing of testing results 460to the operator interface module 410. The listing of testing results 460may indicate whether at least one the semiconductor components 106operate as expected, and optionally their location within thesemiconductor wafer 102, whether at least one of the semiconductorcomponents 106 operate unexpected, and optionally their location withinthe semiconductor wafer 102, or any combination thereof. Alternatively,the testing processor 408 may store the listing of test results 460within an internal memory. In another alternate, the listing of testingresults 460 may include a first indication that all of thesemiconductors 106 that operate as expected and/or a second indicationthat indicates at least one of the semiconductor components 106 operateunexpectedly.

The operator interface module 410 may further process the listing oftesting results 460 for display on a graphical user interface. Forexample, the operator interface module 410 may display the listing oftesting results 460 on a video monitor for interpretation by an enduser. Alternatively, the operator interface module 410 may provide thelisting of testing results 460 to the end user. For example, theoperator interface module 410 may record the listing of testing results460 onto a digital recording medium. In another alternate, the operatorinterface module 410 may store the listing of testing results 460 forfuture recovery by the end user.

The operator interface module 410 additionally observes an indicationfrom the end user the initiate the self-contained testing operation,whereby the operator interface module sends an initiate self-containedtesting operation 462 to the testing processor 408 to initiate theself-contained testing operation. The end user may additionally specifythe second set of instructions to be performed and/or the second set ofparameters to be used by the second set of instructions prior toinitiating the self-contained testing operation. Alternatively, thetesting processor 408 may load the second set of instructions and/or thesecond set of parameters from the internal memory. The operatorinterface module 410 provides the second set of instructions and/or thesecond set of parameters to the testing processor 408 as part of theinitiate self-contained testing operation 462.

The transmitter module 412 receives the initiate self-contained testingoperation 462 from the testing processor 408 via an initiateself-contained testing operation 464. The transmitter module 412encodes, modulates and/or upconverts the testing operation commandsignal 464 to provide an initiate testing operation signal 466 to thesemiconductor wafer 102 via a transmitting antenna 414. In an exemplaryembodiment, the transmitter module 412 wirelessly sends the initiatetesting operation signal 466 to all of the semiconductor components 106within the semiconductor wafer 102. However, this example is notlimiting, those skilled in the relevant art(s) will recognize that theinitiate testing operation signal 466 may be sent to a lesser number ofthe semiconductor components 106 within the semiconductor wafer 102without departing from the spirit and scope of the present invention.The initiate testing operation signal 466 represents an exemplaryembodiment of the initiate testing operation signal 150.

Second Exemplary Wireless Component Testing Environment

As an alternate to the semiconductor mapping as described above, each ofthe one or more semiconductor components is tagged at manufacturing,during testing, or implementation in the field with a uniqueidentification number. The unique identification number represents aseries of bits that is unique to each of the one or more semiconductorcomponents.

FIG. 8 illustrates a schematic block diagram of a second wirelesscomponent testing environment according to a second exemplary embodimentof the present invention. A wireless testing environment 800 allows forsimultaneous testing of the semiconductor components 106 by wirelessautomatic test equipment 802. The wireless automatic test equipment 802wirelessly tests one or more of the semiconductor components 106simultaneously to verify that these one or more of the semiconductorcomponents 106 operate as expected.

The wireless automatic test equipment 802 sends initiate testingoperation signals 850.1 through 850.n, herein initiate testing operationsignals 850, to the semiconductor components 106. The initiate testingoperation signals 850 represent one or more radio communication signalsthat are wirelessly transmitted using the common communication channel154 to the semiconductor components 106 using one or more transmittingantennas positioned in three-dimensional space as described above inFIG. 5A through FIG. 5C. The wireless automatic test equipment 802 mayserially provide the initiate testing operation signals 850 or,alternatively, simultaneously provide the initiate testing operationsignals 850 using a multiple access transmission scheme. In an exemplaryembodiment, the wireless automatic test equipment 802 may encode each ofthe initiate testing operation signals 850 using a different spreadingcode in accordance with code division multiple access (CDMA) scheme. Forexample, the wireless automatic test equipment 802 may encode a firstinitiate testing operation signal 850.1 and a second initiate testingoperation signal 850.2 using a first spreading code and a secondspreading code, correspondingly, and simultaneously provide the firstinitiate testing operation signal 850.1 and the second initiate testingoperation signal 850.2 to the semiconductor components 106 over thecommon communication channel 854.

One or more of the semiconductor components 106 observe the initiatetesting operation signals 850 as they pass through the commoncommunication channel 854. These semiconductor components 106 determineone or more signal metrics, such as a mean, a total energy, an averagepower, a mean square, an instantaneous power, a root mean square, avariance, a norm, a voltage level and/or any other suitable signalmetric that will be apparent by those skilled in the relevant art(s)provide some examples, of the initiate testing operation signals 850.The semiconductor components 106 utilize the one or more signal metricsto generate a unique identification number, or tag, which may be used bythe wireless automatic test equipment 802 to determine a location of thesemiconductor components 106 within the semiconductor wafer 102. Thesemiconductor components 106 may store their corresponding uniqueidentification number into one or more memory devices such as anysuitable non-volatile memory, any suitable volatile memory, or anycombination of non-volatile and volatile memory that will be apparent bythose skilled in the relevant art(s) without departing from the spiritand scope of the present invention.

The semiconductor components 106 that received the initiate testingoperation signals 850 enter into a testing mode of operation, wherebythese semiconductor components 106 execute the self-contained testingoperation as described above. After completion of the self-containedtesting operation, the semiconductor components 106 wirelessly transmita testing operation outcome 852 to the wireless automatic test equipment802 via the common communication channel 854. Collectively, thesemiconductor components 106 communicate the testing operation outcome852 over the common communication channel 154 using the multiple accesstransmission scheme as described above. The testing operation outcome852 includes the unique identification number for each of thesemiconductor components 106 to allow the wireless automatic testequipment 802 to determine the location of the semiconductor components106 within the semiconductor wafer 102.

The wireless automatic test equipment 802 observes the testing operationoutcome 852 as it passes through the common communication channel usinga receiving antenna positioned in the three-dimensional space. Thewireless automatic test equipment 802 determines a first group ofsemiconductor components from among the semiconductor components 106that operate as expected, and optionally their location within thesemiconductor wafer 102, based upon the testing operation outcome 852 asobserved by the receiving antenna. Alternatively, the wireless automatictest equipment 802 may determine a second group of semiconductorcomponents from among the semiconductor components 106 that operateunexpectedly based upon the testing operation outcome 852 as observed bythe receiving antenna. The wireless automatic test equipment 802 may,optionally, provide a location of the second group of semiconductorcomponents within the semiconductor wafer 102. In another alternate, thewireless automatic test equipment 104 may determine any combination ofthe first group of semiconductor components and the second group ofsemiconductor components and, optionally, provide their correspondinglocations within the semiconductor wafer 102.

Second Exemplary Semiconductor Component

FIG. 9 illustrates a schematic block diagram of a second semiconductorcomponent according to a first exemplary embodiment of the presentinvention. A semiconductor component 900 observes the initiate testingoperation signals 850 from the wireless automatic test equipment 802.The semiconductor component 900 represents an exemplary embodiment ofone of the semiconductor components 106. The semiconductor component 900determines one or more signal metrics of the initiate testing operationsignals 850 to generate a unique identification number, or tag, that maybe used by the wireless automatic test equipment 802 to determine alocation of the semiconductor components 106 within the semiconductorwafer 102. The semiconductor component 900 performs the self-containedtesting operation in response to receiving the initiate testingoperation signals 850. After completion of the self-contained testingoperation, the semiconductor component 900 wirelessly transmits anindividual testing operation outcome 950 of the self-contained testingoperation. The individual testing operation outcome 950 represents anexemplary embodiment of one of the testing operation outcomes 852.

The semiconductor component 900 includes the integrated circuit undertest 214, a transceiver module 902, a metric measurement module 904, anda testing module 906. The transceiver module 902 provides initiate testcontrol signals 952.1 through 952.i, herein initiate test controlsignals 952.1, based upon the initiate testing operation signals 850 andthe individual testing operation outcome 950 based upon the indicationof operability 254. More specifically, the transceiver module 902includes a receiver module 908 and a transmitter module 910. Thereceiver module 908 downconverts, demodulates, and/or decodes theinitiate testing operation signals 850 to provide the initiate testcontrol signals 952.

Exemplary Receiver Module Implemented as Part of the Second ExemplarySemiconductor Component

FIG. 10 illustrates a schematic block diagram of a receiver moduleimplemented as part of the second exemplary semiconductor componentaccording to an exemplary embodiment of the present invention. Areceiver module 1000 downconverts, demodulates, and/or decodes theinitiate testing operation signals 850 to provide the initiate testcontrol signals 952 in accordance with the multiple access transmissionscheme. The receiver module 1000 represents an exemplary embodiment ofthe receiver module 908.

The receiver module 1000 includes a downconverter module 1002, ademodulating module 1004, and a decoding module 1006. The downconvertermodule 1002 frequency translates or downconverts the initiate testingoperation signals 850 to a baseband frequency or an intermediatefrequency (IF) to provide downconverted testing operation outcomes1052.1 through 1052.i, herein downconverted testing operation outcomes1052. More specifically, the downconverter module 1002 may downconvertthe initiate testing operation signals 850 using a single carrierfrequency to implement the single carrier multiple access transmissionscheme or among multiple carriers to implement the multiple carriermultiple access transmission scheme to provide the downconverted testingoperation outcomes 1052. In an exemplary embodiment, the downconvertermodule 1002 is optional. In this exemplary embodiment, the demodulatingmodule 1004 directly observes the initiate testing operation signals850.

The demodulating module 1004 demodulates the downconverted testingoperation outcomes 1052 using any suitable analog or digitaldemodulation technique for any suitable modulation technique such asamplitude modulation (AM), frequency modulation (FM), phase modulation(PM), phase shift keying (PSK), frequency shift keying (FSK), amplitudeshift keying (ASK), quadrature amplitude modulation (QAM) and/or anyother suitable modulation technique that will be apparent to thoseskilled in the relevant art(s) to provide demodulated testing operationoutcomes 1054.1 through 1054.i, herein demodulated testing operationoutcomes 1054.

The decoding module 1006 decodes the demodulated testing operationoutcomes 1054 using any suitable multiple access transmission scheme toprovide the initiate test control signals 952. In an exemplaryembodiment, the decoding module 1006 decodes the demodulated testingoperation outcomes 1054 in accordance with a code division multipleaccess (CDMA) scheme. In this exemplary embodiment, the decoding module1006 includes a despreading code generator 1008 and a despreading module1010. The despreading code generator 1008 provides unique random,pseudo-random, and/or non-random sequences of data, referred to asdespreading codes 1056.1 through 1056.n, to the despreading module 1010.Each of the despreading codes 1056.1 through 1056.n represent aspreading code that corresponds to each of the initiate testingoperation signals 850. For example, the despreading code 1056.1represents the spreading code used by the wireless automatic testequipment 802 to provide the initiate testing operation signal 850.1.The despreading code module 1010 utilizes the despreading codes 1056.1through 1056.n to decode the demodulated testing operation outcomes 1054to provide a total of n*i=k initiate test control signals 952.

Referring again to FIG. 9, the transmitter module 210 encodes,modulates, and/or upconverts the indication of operability 254 inaccordance with the multiple access transmission scheme to provide theindividual testing operation outcome 950, as discussed above.

The metric measurement module 904 determines one or more signal metricsof the initiate test control signals 952 to provide measured signalmetrics 954.1 through 954.k, herein measured signal metrics 954. The oneor more signal metrics may include a mean, a total energy, an averagepower, a mean square, an instantaneous power, a root mean square, avariance, a norm, a voltage level and/or any other suitable signalmetric of the initiate test control signals 952 that will be apparent bythose skilled in the relevant art(s) without departing from the spiritand scope of the present invention.

The testing module 906 operates in a substantially similar manner as thetesting module 216; therefore only differences between the testingmodule 216 and the testing module 906 are to be discussed in furtherdetail. The testing module 906 utilizes the measured signal metrics 954to generate a unique identification number, or tag, which corresponds tothe semiconductor component 900. Specifically, the measured signalmetrics 954 for each of the semiconductor components 900 within thesemiconductor wafer 106 may differ as a result of differences indistances between each of the semiconductor components 900 and the oneor more transmitting antennas that provide the initiate testingoperation signals 850. The testing module 906 may quantify the measuredsignal metrics 954 to generate the unique identification number. Forexample, in an embodiment of the wireless automatic test equipment 802having a first transmitting antenna and a second transmitting antenna,the testing module 906 may quantify the measured signal metric 954.1corresponding to the initiate testing operation signal 850.1 provided bythe first transmitting antenna as r bits of an s bit uniqueidentification number and the measured signal metric 954.2 correspondingto the initiate testing operation signal 850.2 provided by the secondtransmitting antenna as t bits of the s bit unique identificationnumber. The testing module 906 may quantify the measured signal metrics954 using a look-up table, an analog to digital converter (ADC), or anyother suitable means that will be apparent to those skilled in therelevant art(s) without departing from the spirit and scope of thepresent invention. The testing module 906 may store the uniqueidentification number into one or more memory devices such as anysuitable non-volatile memory, any suitable volatile memory, or anycombination of non-volatile and volatile memory that will be apparent bythose skilled in the relevant art(s) without departing from the spiritand scope of the present invention.

The testing module 906 may additionally append the unique identificationnumber stored in the one or more memory devices as a header to theindication of operability 258, or within the indication of operability258, before providing the indication of operability 254 to thetransceiver module 902.

In an exemplary embodiment, the testing module 906 only provides theindication of operability 254 to the transceiver module 202 when theindication of operability 258 indicates the integrated circuit undertest 204 operates as expected. In this situation, the transceiver module202 does not provide the individual testing operation outcome 950 whenthe integrated circuit under test 204 operates unexpectedly.Alternatively, the testing module 906 only provides the indication ofoperability 254 to the transceiver module 202 when the indication ofoperability 258 indicates the integrated circuit under test 204 operatesunexpectedly. In this situation, the transceiver module 202 does notprovide the individual testing operation outcome 950 when the integratedcircuit under test 204 operates as expected.

Second Exemplary Wireless Automatic Test Equipment

FIG. 11 illustrates a schematic block diagram of a second wirelessautomatic test equipment according to a first exemplary embodiment ofthe present invention. The wireless automatic test equipment 1100includes one or more transmitting antennas to provide the initiatetesting operation signals 850 to the semiconductor components 106 viaone or more directions in three dimensional space via the commoncommunication channel 154. The wireless automatic test equipment 1100includes a receiving antenna to observe the testing operation outcomes852 in the three dimensional space. The wireless automatic testequipment 1100 may determine whether one or more of the semiconductorcomponents 106 operate as expected and, optionally, may determine alocation of the one or more of the semiconductor components 106 withinthe semiconductor wafer 102 using unique identification number embeddedwithin the testing operation outcomes 852. The wireless automatic testequipment 1100 represents an exemplary embodiment of the wirelessautomatic test equipment 104.

The wireless automatic test equipment 1100 includes the operatorinterface module 410, a receiving antenna 1102, a receiver module 1104,a testing processor 1106, a transmitter module 1108, and transmittingantennas 1110.1 through 1110.i. The receiving antenna 1102 observes thetesting operation outcome 852 as it passes through the commoncommunication channel 154 to provide an observed testing operationoutcome 1152. Alternatively, the wireless automatic test equipment 1100may include multiple receiving antennas 1102.1 through 1102.i that aresubstantially similar to the receiving antennas 402 as discussed aboveto observe the testing operation outcome 852 it passes through thecommon communication channel 154 at corresponding positions in the threedimensional space to provide observed testing operation outcomes 1152.1through 1152.i.

The receiver module 1104 downconverts, demodulates, and/or decodes theobserved testing operation outcome 1152 to provide recovered testingoutcomes 1154.1 through 1154.i, herein recovered testing outcomes 1154,in accordance with the multiple access transmission scheme, as discussedabove. In an exemplary embodiment, the receiver module 1104 may beimplemented in a substantially manner as the receiver module 600. Inthis exemplary embodiment, the receiver module 600 is implemented usinga single input, namely the observed testing operation outcome 1152, toprovide multiple outputs, namely the recovered testing outcomes 1154.

The testing processor 1106 may determine a first group of semiconductorcomponents from among the semiconductor components 106 that operate asexpected based upon the recovered testing outcomes 1154. Alternatively,the testing processor 1106 may determine a second group of semiconductorcomponents from among the semiconductor components 106 that operateunexpectedly based upon the recovered testing outcomes 1154. In anotheralternate, the testing processor 1106 may determine any combination ofthe first group of semiconductor components and the second group ofsemiconductor components.

In an exemplary embodiment, the testing processor 1106 may provide thetesting operation command signal 1156 to the transmitter module 1108that causes the transmitter module 1108 to provide the initiate testingoperation signals 850 that causes those semiconductor components 106that operate as expected to enter into a transmitting state and thosesemiconductor components 106 that operate unexpectedly to enter into anon-transmitting state. Alternatively, the testing processor 1106 mayprovide the testing operation command signal 1156 to the transmittermodule 1108 that causes the transmitter module 1108 to provide theinitiate testing operation signals 850 that causes those semiconductorcomponents 106 that operate unexpectedly to enter into a transmittingstate and those semiconductor components 106 that operate as expected toenter into a non-transmitting state. In these exemplary embodiments,only those semiconductor components 106 that are in the transmittingstate provide their respective testing operation outcome 852.

The testing processor 1106 may, optionally, determine a location of thesemiconductor components 106 within the semiconductor wafer 102 basedupon the unique identification number for each of the semiconductorcomponents 106 that is embedded within the testing operation outcome852. The testing processor 1106 may determine the location of each ofthe semiconductor components 106, those semiconductor components 106 inthe transmitting state, those semiconductor components 106 in thenon-transmitting state, and/or any combination thereof. The testingprocessor 1106 may assemble a map indicating the location of thesemiconductor components 106 within the semiconductor wafer 102 bycomparing the unique identification numbers to a predetermined mappingof the unique identification numbers to their respective locationswithin the semiconductor wafer 102. Alternatively, the testing processor1106 may iteratively interpolate the location of the semiconductorcomponents 106 within the semiconductor wafer 102 based uponrelationships between the unique identification numbers for each of thesemiconductor components 106. For example, the unique identificationnumbers embedded within the testing operation outcome 852 may include afirst unique identification number and a second unique identificationnumber. In this example, the testing processor 1106 may compare thefirst r bits of the first unique identification number with the first rbits of the second unique identification number. If the first r bits ofthe first unique identification number are greater than the first r bitsof the second unique identification number, then the semiconductorcomponent 106 that corresponds to the first unique identification iscloser to the receiving antenna 1102 when compared to the semiconductorcomponent 106 that corresponds to the second unique identification. Asanother example, if the first r bits of the first unique identificationnumber are less than the first r bits of the second uniqueidentification number, then the semiconductor component 106 thatcorresponds to the first unique identification is farther from thereceiving antenna 1102 when compared to the semiconductor component 106that corresponds to the second unique identification.

The transmitter module 1108 receives an testing operation command signal1156 from the testing processor 1106. The transmitter module 1108encodes, modulates and/or upconverts the testing operation commandsignal 1156 to provide initiate testing operation signals 1158.1 through1158.i.

Exemplary Transmitter Module Implemented as Part Of the Second ExemplaryWireless Automatic Test Equipment

FIG. 12 illustrates a schematic block diagram of a first transmittermodule implemented as part of the second wireless automatic testequipment according to a first exemplary embodiment of the presentinvention. A transmitter module 1200 encodes, modulates, and/orupconverts the indication of operability 254 to provide the individualtesting operation outcome 250 in accordance with the multiple accesstransmission scheme, as discussed above. The transmitter module 1200represents an exemplary embodiment of the transmitter module 210.

The transmitter module 1200 includes an encoding module 1202, amodulating module 1208, and an upconverter module 1210. The encodingmodule 1202 encodes the testing operation command signal 1156 inaccordance with the multiple access transmission scheme to provide anencoded indication of operability 1250. In an exemplary embodiment, theencoding module 1202 encodes the testing operation command signal 1156in accordance with a code division multiple access (CDMA) scheme. Inthis exemplary embodiment, the encoding module 1202 includes a spreadingcode generator 1204 and a spreading module 1206. The spreading codegenerator 1204 provides a unique random, pseudo-random, and/ornon-random sequence of data, referred to as a spreading code 1252, tothe spreading module 1206. The spreading code 1252 represents to asequence of bits that is unique to each of the transmitting antennas1110.1 through 1110.i, herein the transmitting antennas 1110, or groupsof the transmitting antennas 1110, to encode the indication ofoperability 254. The spreading module 1206 utilizes the spreading code1252 to encode the testing operation command signal 1156 to providespreaded initiate self-contained testing operations 1254.1 through1254.1.

The modulating module 1208 modulates the spreaded initiateself-contained testing operations 1254.1 through 1254.1 using anysuitable analog or digital modulation techniques such as amplitudemodulation (AM), frequency modulation (FM), phase modulation (PM), phaseshift keying (PSK), frequency shift keying (FSK), amplitude shift keying(ASK), quadrature amplitude modulation (QAM) and/or any other suitablemodulation technique that will be apparent to those skilled in therelevant art(s) to provide modulated initiate self-contained testingoperations 1256.1 through 1256.i.

The upconverter module 1210 frequency translates or upconverts themodulated initiate self-contained testing operations 1256.1 through1256.i to provide the initiate testing operation signals 1158.1 through1158.i. More specifically, the upconverter module 1210 may upcovert themodulated initiate self-contained testing operations 1256.1 through1256.i using a single carrier frequency and/or among multiple carriersto implement the multiple access transmission to provide the initiatetesting operation signals 1158.1 through 1158.i. In an exemplaryembodiment, the upconverter module 1210 is optional. In this exemplaryembodiment, the modulating module 1208 directly provides the modulatedinitiate self-contained testing operations 1256.1 through 1256.1 as theinitiate testing operation signals 1158.1 through 1158.i.

Referring again to FIG. 11, the transmitting antennas 1110 provide theinitiate testing operation signals 1158.1 through 1158.i as the initiatetesting operation signals 850.1 through 850.i to the semiconductorcomponents 106. In an exemplary embodiment, the transmitter module 1108wirelessly sends the initiate testing operation signals 850.1 through850.i to all of the semiconductor components 106 within thesemiconductor wafer 102. However, this example is not limiting, thoseskilled in the relevant art(s) will recognize that initiate testingoperation signals 850.1 through 850.i may be sent to a lesser number ofthe semiconductor components 106 within the semiconductor wafer 102without departing from the spirit and scope of the present invention.The transmitting antennas 1110 may be positioned in the threedimensional space in a substantially similar manner as the receivingantennas 402. In another exemplary embodiment, the transmitting antennas1110 include two transmitting antennas, namely a first transmittingantenna 1110.1 and a second transmitting antenna 1110.2. In thisexemplary embodiment, the first transmitting antenna 1110.1 and thesecond transmitting antenna 1110.2 are placed at a distance of d₁ andd₂, correspondingly, from a center of the semiconductor wafer 102, thedistance d₁ and the distance d₂ being similar to or dissimilar from eachother. In this exemplary embodiment, the first transmitting antenna1110.1 is separated from the second transmitting antenna 1110.2 by anangle θ, such as ninety degrees to provide an example.

It should be noted that particular features, structures, orcharacteristics of the wireless automatic test equipment 400 and/or thewireless automatic test equipment 1100 are not limited to theembodiments of these wireless automatic test equipment as discussedabove in FIG. 4 and FIG. 11. Rather, particular features, structures, orcharacteristics of the wireless automatic test equipment 400 may becombined with particular features, structures, or characteristics of thewireless automatic test equipment 1100 to provide additional exemplaryembodiments of the wireless automatic test equipment. For example,another exemplary embodiment of the wireless automatic test equipmentmay include the receiving antennas 402 as discussed above in FIG. 4 andthe transmitting antenna 1110 as discussed above in FIG. 11. Likewise,particular features, structures, or characteristics of the semiconductorcomponent 200, and/or the semiconductor component 900 are not limited tothe embodiments of these semiconductor components as discussed above inFIG. 2 and FIG. 9. Rather, particular features, structures, orcharacteristics of the semiconductor component 200 and/or thesemiconductor component 900 may be combined with features, structures,or characteristics from one another to provide additional exemplaryembodiments of the semiconductor component.

Methods to Verify the Semiconductor Components Operate as Expected and,Optionally, to Determine a Location of the Semiconductor Componentswithin the Semiconductor Wafer

FIG. 13 is a flowchart 1300 of exemplary operational steps of a wirelessautomatic test equipment according to an exemplary embodiment of thepresent invention. The invention is not limited to this operationaldescription. Rather, it will be apparent to persons skilled in therelevant art(s) from the teachings herein that other operational controlflows are within the scope and spirit of the present invention. Thefollowing discussion describes the steps in FIG. 13.

At step 1302, one or more semiconductor components, such as one or moresemiconductor components from among the semiconductor components 106 toprovide an example, within a semiconductor wafer, such as thesemiconductor wafer 102 to provide an example, are activated. The one ormore semiconductor components may represent some or all of thesemiconductor components that are formed onto the semiconductor wafer.The one or more semiconductor components may be activated by wirelesslyreceiving power from wireless automatic test equipment, such as thewireless automatic test equipment 104 or the wireless automatic testequipment 802 to provide some examples, as disclosed in U.S. patentapplication Ser. No. 12/877,955, filed on Sep. 8, 2010, which claims thebenefit of U.S. Provisional Patent Application No. 61/298,751, filed onJan. 27, 2010, each of which is incorporated by reference in itsentirety. Alternatively, the one or more semiconductor components mayreceive power from a reduced semiconductor wafer testing probe. Thereduced semiconductor wafer testing probe is less complicated than theconventional wafer testing probe, namely this reduced semiconductorwafer testing probe does not include a full complement of electronictesting probes to verify that the semiconductor components operate asexpected. In an exemplary embodiment, this reduced semiconductor wafertesting probe only includes sufficient probes to provide the power tothe one or more semiconductor components.

At step 1304, the wireless automatic test equipment provides a firstinitiate testing operation signal, such as the initiate testingoperation signal 150 and/or a second initiate testing operation signal,such as the initiate testing operation signal 850 to the one or moresemiconductor components from step 1302. The wireless automatic testequipment provides the first initiate testing operation signal using atransmitting antenna, such as a transmitting antenna 414 to provide anexample, and/or the second initiate testing operation signal usingmultiple transmitting antennas, such as the transmitting antennas 1110to provide an example, positioned in three dimensional space asdescribed in FIG. 5A through FIG. 5C. The one or more semiconductorcomponents from step 1302 may optionally determine one or more signalmetrics of the second initiate testing operation signal from each of themultiple transmitting antennas. The one or more semiconductor componentsfrom step 1302 may generate a unique identification number, or tag,based upon the one or more signal metrics which may be used by thewireless automatic test equipment to determine a location of the one ormore semiconductor components from step 1302 within the semiconductorwafer from step 1302. Alternatively, the one or more semiconductorcomponents from step 1302 may include a random number generator togenerate the unique identification number.

The first initiate testing operation signal and/or the second initiatetesting operation signal may include a first set of parameters to beused by a first set of instructions that are stored within the one ormore semiconductor components from step 1302 to perform a self-containedtesting operation. Alternatively, the first initiate testing operationsignal and/or the second initiate testing operation signal may include asecond set of instructions and/or a second set of parameters to be usedby the second set of instructions that are to be used by the one or moresemiconductor components from step 1302 to perform a self-containedtesting operation. In another alternate, the first initiate testingoperation signal and/or the second initiate testing operation signal mayinclude any combination of the first set of parameters, the second setof parameters, and/or the second set of instructions.

At step 1306, the one or more semiconductor components from step 1302execute the self-contained testing operation. The self-contained testingoperation may utilize the first set of parameters provided by the firstinitiate testing operation signal and/or the second initiate testingoperation signal from step 1304 to perform the first set of instructionsthat are stored within the one or more semiconductor components fromstep 1302. Alternatively, the self-contained testing operation mayexecute the second set of instructions provided by the first initiatetesting operation signal and/or the second initiate testing operationsignal from step 1304 and/or the second set of parameters to be used bythe second set of instructions that are provided by the by the firstinitiate testing operation signal and/or the second initiate testingoperation signal from step 1304. In another alternate, theself-contained testing operation may include any combination of thefirst set of instructions, the second set of instructions, the first setof parameters and/or the second set of parameters.

At step 1308, the one or more semiconductor components from step 1302communicate a testing operation outcome, such as the testing operationoutcomes 152 and/or the testing operation outcome 852 to provide someexamples, of the self-contained testing operation to the wirelessautomatic test equipment from step 1302. The one or more semiconductorcomponents from step 1302 wirelessly transmit the testing operationoutcomes to the wireless automatic test equipment from step 1302 over acommon communication channel using the multiple access transmissionscheme as described above. The testing operation outcome may include theunique identification number from step 1304 to allow the wirelessautomatic test equipment from step 1302 to determine the location of thesemiconductor components from step 1302 within the semiconductor waferfrom step 1302.

At step 1310, the wireless automatic test equipment from step 1302observes the testing operation outcomes from step 1308 as they passthrough the common communication channel. The wireless automatic testequipment from step 1302 may observe the testing operation outcomes fromstep 1308 using a receiving antenna, such as a receiving antenna 1102 toprovide an example, or multiple receiving antennas, such as thereceiving antennas 402 to provide an example, positioned in threedimensional space as described in FIG. 5A through FIG. 5C.

At step 1312, the wireless automatic test equipment from step 1302 maydetermine which of the one or more semiconductor components from step1302 operate as expected and, optionally, their location within thesemiconductor wafer from step 1302 based upon the testing operationoutcomes observed from step 1310.

The wireless automatic test equipment from step 1302 may determine afirst group of semiconductor components from among the one or moresemiconductor components from step 1302 that operate as expected basedupon the testing operation outcomes observed from step 1310. Thewireless automatic test equipment from step 1302 evaluates the testingoperation outcomes observed from step 1310 for each of the uniqueidentification numbers from step 1304 to determine whether itscorresponding the one or more semiconductor components from step 1302 ispart of the first group of semiconductor components. Alternatively, thewireless automatic test equipment from step 1302 may determine a secondgroup of semiconductor components from among the one or moresemiconductor components from step 1302 that operate unexpectedly basedupon the testing operation outcomes observed from step 1310. In anotheralternate, the wireless automatic test equipment from step 1302 maydetermine any combination of the first group of semiconductor componentsand the second group of semiconductor components. The wireless automatictest equipment from step 1302 may, optionally, determine one or moresignal metrics of the testing operation outcomes observed from step 1310to determine a location of the one or more semiconductor components fromstep 1302 within the semiconductor wafer from step 1302.

The wireless automatic test equipment from step 1302 may assign the oneor more signal metrics to corresponding coordinates from among i sets ofcoordinates in the three dimensional space. The wireless automatic testequipment from step 1302 assigns the unique identification number fromstep 1304 to the i sets of coordinates. The wireless automatic testequipment from step 1302 maps the unique identification number from step1304 to their corresponding semiconductor component 106 to determine thelocation of the one or more semiconductor components from step 1302within the semiconductor wafer from step 1302. The wireless automatictest equipment from step 1302 may determine the location of the one ormore semiconductor components from step 1302 by comparing the one ormore signal metrics corresponding to each of the unique identificationnumber from step 1304 to predetermined signal metrics for each of theone or more semiconductor components from step 1302. Alternatively, thewireless automatic test equipment from step 1302 may iterativelyinterpolate the location of the unique identification numbers from step1304 to the semiconductor components from step 1302 within thesemiconductor wafer from step 1302 based upon relationships betweentheir corresponding one or more signal metrics.

Alternatively, the wireless automatic test equipment from step 1302 mayassemble a map indicating the location of the semiconductor componentsfrom step 1302 within the semiconductor wafer from step 1302 bycomparing the unique identification numbers to a predetermined mappingof the unique identification numbers to their respective locationswithin the semiconductor wafer from step 1302. Alternatively, thewireless automatic test equipment from step 1302 may iterativelyinterpolate the location of the semiconductor components from step 1302within the semiconductor wafer from step 1302 based upon relationshipsbetween the unique identification numbers for each of the semiconductorcomponents from step 1302.

Tagging of Functional Blocks of the Semiconductor Components

FIG. 14 illustrates a schematic block diagram of an integrated circuitunder test implemented as part of the first and/or the second exemplarysemiconductor components according to an exemplary embodiment of thepresent invention. An integrated circuit under test 1400 executes theself-contained testing operation 256 to determine whether it operates asexpected. The integrated circuit under test 1400 includes one or morehardware modules, whereby some of these hardware modules may be dividedinto functional blocks B1 through B4. However, this example is forillustrative purposes only, it will be apparent to those skilled in therelevant art(s) that the integrated circuit under test 1400 may bedivided differently into a lesser or a greater number of functionalblocks without departing from the spirit and scope of the presentinvention.

The functional blocks B1 through B4 may encompass different hardwaremodules of the integrated circuit under test 1400 which may performdiffering and/or similar functions. For example, a first functionalblock B1 may encompass a first transmitter that is configured to operatein accordance with an Institute of Electrical and Electronics Engineers(IEEE) communication standard, such as the IEEE 802.11 communicationsstandard to provide an example. In this example, a second functionalblock B2 may encompass a second transmitter that is configured tooperate in accordance with a Bluetooth communication standard.Additionally, some of the hardware modules of the integrated circuitunder test 1400 may be assigned to more than one of the functionalblocks B1 through B4. From the example above, the first transmitter andthe second transmitter may share a common amplifier module. This commonamplifier module may be assigned to the first functional block B1 andthe second functional block B2 or assigned to a third functional blockB3 that encompasses different hardware from the first functional blockB1 and the second functional block B2.

Each of the functional blocks B1 through B4 may be assigned, or tagged,with a unique identifier. The unique identifier represents a sequence ofbits that is unique to each of the functional blocks B1 through B4. Inan exemplary embodiment, the unique identifier for each of thefunctional blocks B1 through B4 is stored in a memory device, such asany suitable non-volatile memory, any suitable volatile memory, or anycombination of non-volatile and volatile memory that will be apparent tothose skilled in the relevant art(s), that is implemented as part of atesting module, such as the testing module 206 or the testing module 906to provide some examples. In another exemplary embodiment, the uniqueidentifiers for the functional blocks B1 through B4 may be provided tothe memory device by wireless automatic test equipment, such as thewireless automatic test equipment 400 or the wireless automatic testequipment 1100 to provide some examples. In this exemplary embodiment,the unique identifiers for the functional blocks B1 through B4 may beprovided by the wireless automatic test equipment via an initiatetesting operation signal, such as the initiate testing operation signal150 or the initiate testing operation signals 850 to provide an example.Alternatively, the unique identifiers for the functional blocks B1through B4 may be written into the memory device during manufacture of asemiconductor component that includes the integrated circuit under test1400. In another alternate, each of the functional blocks B1 through B4may include the memory device which stores the unique identifier foreach of the functional blocks B1 through B4.

The functional blocks B1 through B4 may execute the self-containedtesting operation 256, or a portion thereof, to determine whether theyoperate as expected. For example, the self-contained testing operation256 may include one or more testing routines to be performed by thefunctional blocks B1 through B4. The one or more testing routines mayinclude any combination of the first set of instructions, the second setof instructions, the first set of parameters and/or the second set ofparameters as discussed above. In this example, the functional block B1and the functional block B2 may execute a first testing routine and asecond testing routine, respectively, thereof, to determine whether theyoperate as expected. Alternatively, the functional block B1 may executethe first testing routine and provide information resulting from theexecution of the first testing routine to the functional block B2. Thefunctional block B2 may use this information to execute the secondtesting routine to determine whether it operates as expected.

The functional blocks B1 through B4 provide the indication ofoperability 258 to the testing module, such as the testing module 206 orthe testing module 906 to provide some examples, during and/or afterexecution of the self-contained testing operation 256. The indication ofoperability indicates whether the functional blocks B1 through B4operate as expected or, alternatively, whether the functional blocks B1through B4 operate unexpectedly and, optionally, the one or more of thefunctional blocks B1 through B4 that operates unexpectedly.Alternatively, the functional blocks B1 through B4 may provide theirunique identifier as the indication of operability 258 to indicate thatits corresponding functional block B1 through B4 operates as expectedor, alternatively, operates unexpectedly.

The testing module, such as the testing module 206 or the testing module906 to provide some examples, may analyze the indication of operability258 to provide an indication of operability, such as the indication ofoperability 254 to provide an example. The testing module may providethe indication of operability that indicates that the functional blocksB1 through B4 operate as expected or, alternatively, or indicates thatthe functional blocks B1 through B4 operate unexpectedly and,optionally, the unique identifier corresponding to the functional blocksB1 through B4 that operates unexpectedly.

The tagging of the functional blocks of the semiconductor components inthe manner as described above allows the wireless automatic testequipment, such as the wireless automatic test equipment 400 or thewireless automatic test equipment 1100 to provide some examples, todetermine which functional blocks operate as expected. This allowsmanufacturers of the semiconductor components to distributesemiconductor components having lesser functionality even though thesesemiconductor components may be designed to perform greaterfunctionality. For example, the integrated circuit under test 1400 mayinclude a first transmitter that is configured to operate in accordancewith the IEEE communication standard and a second transmitter that isconfigured to operate in accordance with the Bluetooth communicationstandard. In this example, the manufacturers of the integrated circuitunder test 1400 may be able to distribute the semiconductor componenthaving the integrated circuit under test 1400 as having the firsttransmitter even though the second transmitter does not operate asexpected.

Optional Modules that May be Implemented as Part of the First or theSecond Exemplary Wireless Automatic Test Equipment

FIG. 15 illustrates a schematic block diagram of a thermal imagingmodule that may be implemented as part of the first or the secondexemplary wireless automatic test equipment according to an exemplaryembodiment of the present invention. A wireless testing environment 1500includes a wireless testing equipment 1502 to allow for simultaneoustesting of the semiconductor wafer 152 to verify that the semiconductorcomponents 106 operate as expected. The wireless testing equipment 1502has many features in common with the wireless testing equipment 104and/or the wireless testing equipment 802 as discussed above; therefore,only differences between the wireless testing equipment 1502 and thewireless testing equipment 104 and/or the wireless testing equipment 802are to be described in further detail.

The wireless testing equipment 1502 includes a performance measurementmodule 1504 to measure a performance of the semiconductor components106. The performance measurement module 1504 observes semiconductorwafer infrared energy 1550 that is produced by the semiconductor wafer152. More specifically, the semiconductor components 106 produce acorresponding one of semiconductor component infrared energies 1552.1through 1552.n before, during, and/or after execution of theself-contained testing operation. For example, the semiconductorcomponent 156.1 produces the semiconductor component infrared energy1552.1 during execution of the self-contained testing operation.

The performance measurement module 1504 processes the semiconductorwafer infrared energy 1550 to provide a semiconductor wafer thermogramof the semiconductor wafer 152. The performance measurement module 1504isolates a semiconductor component thermogram for the semiconductorcomponents 106 from the semiconductor wafer thermogram. The performancemeasurement module 1504 compares the semiconductor component thermogramsto one or more predetermined semiconductor component thermograms tomeasure the performance of the semiconductor components 106.

Second Exemplary Wireless Automatic Test Equipment

FIG. 16 illustrates a schematic block diagram of an optional performancemeasurement module implemented as part of the first or the secondexemplary wireless automatic test equipment according to an exemplaryembodiment of the present invention. A performance measurement module1600 includes a thermal imaging module 1602 and a thermogram processor1604 to measure a performance of the semiconductor components 106 basedupon the semiconductor wafer infrared energy 1550. The performancemeasurement module 1600 may represent an exemplary embodiment of theperformance measurement module 1504.

The thermal imaging module 1602 includes a thermal imaging device, suchas a thermographic camera, a thermographic sensor, and/or any othersuitable device that is capable of detecting infrared energy of theelectromagnetic spectrum that is emitted, transmitted, and/or reflectedby the semiconductor wafer 102. The thermal imaging module 1602 observesthe semiconductor wafer infrared energy 1550 that is emitted,transmitted, and/or reflected by the semiconductor wafer 102. Morespecifically, the thermal imaging module 1602 observes the semiconductorcomponent infrared energy 1552.1 through 1552.n as the semiconductorwafer infrared energy 1550 before, during, and/or after execution of theself-contained testing operation. The thermal imaging module 1602provides an observed thermal infrared energy 1650 to the thermogramprocessor 1604.

The thermogram processor 1604 processes the observed thermal infraredenergy 1650 to provide a performance measure 1652 for the semiconductorcomponents 106. The performance measure 1652 may be provided to anoperator interface module, such as the operator interface module 410 toprovide an example, for further processing for display on a graphicaluser interface. Alternatively, the performance measure 1652 may beprovided to a testing processor, such as the testing processor 408and/or the testing processor 1106 to provide some examples, to beincluded as part of the listing of testing results 460.

Exemplary Processing of Thermograms

FIG. 17A illustrates an operation of a thermogram processor used in theoptional performance measurement module according to an exemplaryembodiment of the present invention. The thermogram processor 1604processes the observed thermal infrared energy 1650 to provide asemiconductor wafer thermogram 1700. The semiconductor wafer thermogram1700 indicates the infrared energy emitted, transmitted, and/orreflected by the semiconductor wafer 102 as interpreted by one or morethermal processing algorithms. Those areas of the semiconductor waferthermogram 1700 that are lightly shaded emit, transmit, and/or reflectmore infrared energy than those areas of the semiconductor waferthermogram 1700 that are heavily shaded. The semiconductor waferthermogram 1700 as shown is for illustrative purposes only; thoseskilled in the relevant art(s) will recognize that other semiconductorwafer thermograms are possible without departing from the spirit andscope of the present invention.

The thermogram processor 1604 isolates a corresponding semiconductorcomponent thermogram 1702.1 through 1702.n for each of the semiconductorcomponents 106 from the semiconductor wafer thermogram 1700. Forexample, the thermogram processor 1604 isolates the semiconductorcomponent thermogram 1702.1 corresponding to the semiconductor component106.1 from the semiconductor wafer thermogram 1700. Alternatively, thetesting processor 408 may provide information relating to thosesemiconductor components 106 that operate as expected and their locationwithin the semiconductor wafer 102. In this alternate, the thermogramprocessor 1604 isolates a corresponding semiconductor componentthermogram 1702.1 through 1702.n for those semiconductor components 106that operate as expected from the semiconductor wafer thermogram 1700.

The thermogram processor 1604 compares the semiconductor componentthermograms 1702.1 through 1702.n to one or more predeterminedsemiconductor component thermograms to provide the performance measure1152 for each of the semiconductor components 106, or, alternatively,for those semiconductor components 106 that operate as expected.

FIG. 17B illustrates predetermined semiconductor component thermogramsaccording to an exemplary embodiment of the present invention. Thethermogram processor 1604 compares the semiconductor componentthermograms 1702.1 through 1702.n to a predetermined semiconductor waferthermogram 1704 to provide the performance measure 1152.

The predetermined semiconductor component thermogram 1704 includespredetermined semiconductor wafer thermograms 1706.1 through 1706.n.Each of the predetermined semiconductor wafer thermograms 1706.1 through1706.n are assigned to an indicia of performance 1708.1 through 1708.n.In an exemplary embodiment, the indicia of performance 1708.1 representssemiconductor components of the lowest quality and the indicia ofperformance 1708.n represents semiconductor components of the highestquality. The semiconductor components of the lowest quality emit,transmit, and/or reflect more infrared energy when compared to thesemiconductor components of the highest quality when performing theself-contained testing operation. As a result, the semiconductorcomponents of the highest quality components are suitable to operate athigher operational speeds when compared to the semiconductor componentsof the lower quality.

The semiconductor components 106 that have a corresponding semiconductorcomponent thermogram 1702.1 through 1702.n that closely approximates oneof the predetermined semiconductor wafer thermograms 1706.1 through1706.n are assigned to the corresponding indicia of performance 1708.1through 1708.n. For example, the semiconductor components 106.1 and106.n exhibit the semiconductor component thermograms 1702.1 and 1702.n,correspondingly, that closely approximate the predeterminedsemiconductor wafer thermogram 1706.1; therefore, the semiconductorcomponents 106.1 and 106.n is assigned to the indicia of performance1708.1. Similarly, the semiconductor component 106.2 exhibits thesemiconductor component thermogram 1702.2 that closely approximates thepredetermined semiconductor wafer thermogram 1706.2; therefore, thesemiconductor components 106.2 is assigned to the indicia of performance1708.2.

Methods to Measure a Performance of the Semiconductor Components withinthe Semiconductor Wafer

FIG. 18 is a flowchart 1800 of exemplary operational steps of the secondwireless component testing environment according to an exemplaryembodiment of the present invention. The invention is not limited tothis operational description. Rather, it will be apparent to personsskilled in the relevant art(s) from the teachings herein that otheroperational control flows are within the scope and spirit of the presentinvention. The following discussion describes the steps in FIG. 18.

At step 1802, one or more semiconductor components, such as thesemiconductor components 106 to provide an example, are formed onto asemiconductor wafer, such as the semiconductor wafer 102 to provide anexample, execute a self-contained testing operation in a testing mode ofoperation. The self-contained testing operation represents instructionsto be performed and/or one or more parameters to be used by theinstructions that are used by the one or more semiconductor componentsto determine whether they operate as expected.

At step 1804, a wireless testing equipment, such as the wireless testingequipment 1100 to provide an example, observes infrared energy that isemitted, transmitted, and/or reflected by the semiconductor waferbefore, during, and/or after execution of the self-contained testingoperation. The wireless testing equipment may use a thermal imagingdevice, such as a thermographic camera, a thermographic sensor, and/orany other suitable device that is capable of detecting infrared energyof the electromagnetic spectrum that is emitted, transmitted, and/orreflected by the semiconductor wafer.

At step 1806, the wireless testing equipment processes the observedinfrared energy to provide a semiconductor wafer thermogram of thesemiconductor wafer 102. The semiconductor wafer thermogram indicatesthe infrared energy emitted, transmitted, and/or reflected by thesemiconductor wafer as interpreted by one or more thermal processingalgorithms.

At step 1808, the wireless testing equipment isolates a semiconductorcomponent thermogram for each of the semiconductor components from thesemiconductor wafer thermogram.

At step 1810, the wireless testing equipment compares the semiconductorcomponent thermograms to one or more predetermined semiconductorcomponent thermograms to measure the performance of the semiconductorcomponents. Each of the predetermined semiconductor wafer thermogramsare assigned to an indicia of performance. The semiconductor componentsthat have a corresponding semiconductor component thermogram thatclosely approximates one of the predetermined semiconductor waferthermograms are assigned to the corresponding indicia of performance.

CONCLUSION

It is to be appreciated that the Detailed Description section, and notthe Abstract section, is intended to be used to interpret the claims.The Abstract section may set forth one or more, but not all exemplaryembodiments, of the present invention, and thus, are not intended tolimit the present invention and the appended claims in any way.

The present invention has been described above with the aid offunctional building blocks illustrating the implementation of specifiedfunctions and relationships thereof. The boundaries of these functionalbuilding blocks have been arbitrarily defined herein for the convenienceof the description. Alternate boundaries may be defined so long as thespecified functions and relationships thereof are appropriatelyperformed.

It will be apparent to those skilled in the relevant art(s) that variouschanges in form and detail can be made therein without departing fromthe spirit and scope of the invention. Thus, the present inventionshould not be limited by any of the above-described exemplaryembodiments, but should be defined only in accordance with the followingclaims and their equivalents.

1. A wireless automatic test equipment for simultaneously testing aperformance of a plurality of semiconductor components formed onto asemiconductor wafer, comprising: a thermal imaging module configured toobserve infrared energy produced by the semiconductor wafer to providean observed thermal infrared energy.
 2. The wireless automatic testequipment of claim 1, wherein the thermal imaging module comprises: athermal imaging device configured to detect the infrared energy of theelectromagnetic spectrum from the semiconductor wafer.
 3. The wirelessautomatic test equipment of claim 1, further comprising: a thermogramprocessor configured to determine a semiconductor wafer thermogram basedupon the observed thermal infrared energy and to isolate a plurality ofsemiconductor component thermograms from the semiconductor waferthermogram.
 4. The wireless automatic test equipment of claim 3, whereinthe thermogram processor is further configured to compare each of theplurality of semiconductor component thermograms to plurality ofpredetermined semiconductor component thermograms to provide aperformance measure from among a plurality of performance measurements.5. The wireless automatic test equipment of claim 4, further comprising:a testing processor configured to determine a first group ofsemiconductor components from among the plurality of semiconductorcomponents that operate as expected based upon the plurality ofperformance measurements.
 6. The wireless automatic test equipment ofclaim 5, further comprising: a testing processor configured to determinea second group of semiconductor components from among the plurality ofsemiconductor components that operate unexpectedly based upon theplurality of performance measurements.
 7. The wireless automatic testequipment of claim 3, wherein the thermogram processor is furtherconfigured to determine a first group of semiconductor components fromamong the plurality of semiconductor components that operate as expectedbased upon the plurality of performance measurements.
 8. The wirelessautomatic test equipment of claim 7, wherein the thermogram processor isfurther configured to determine a second group of semiconductorcomponents from among the plurality of semiconductor components thatoperate unexpectedly based upon the plurality of performancemeasurements.
 9. The wireless automatic test equipment of claim 3,wherein the plurality of predetermined semiconductor componentthermograms are assigned to a corresponding indicia of performance fromamong a plurality of indices of performance.
 10. The wireless automatictest equipment of claim 9, wherein the thermogram processor is furtherconfigured to compare each of the plurality of semiconductor componentthermograms to plurality of predetermined semiconductor componentthermograms and to assign the corresponding indicia of performance thatis assigned to a corresponding one of the plurality of predeterminedsemiconductor component thermograms that closely approximates each ofthe plurality of semiconductor component thermograms.
 11. A method forsimultaneously testing a performance of a plurality of semiconductorcomponents formed onto a semiconductor wafer, comprising: (a) observinginfrared energy produced by the semiconductor wafer to provide anobserved thermal infrared energy.
 12. The method of claim 11, whereinstep (a) comprises: (a) observing, by a thermal imaging device, theinfrared energy of an electromagnetic spectrum produced by thesemiconductor wafer.
 13. The method of claim 11, further comprising: (b)determining a semiconductor wafer thermogram based upon the observedthermal infrared energy; and (c) isolating a plurality of semiconductorcomponent thermograms from the semiconductor wafer thermogram.
 14. Themethod of claim 13, further comprising: (d) comparing each of theplurality of semiconductor component thermograms to plurality ofpredetermined semiconductor component thermograms to provide aperformance measure from among a plurality of performance measurements.15. The method of claim 14, further comprising: (e) determining a firstgroup of semiconductor components from among the plurality ofsemiconductor components that operate as expected based upon theplurality of performance measurements.
 16. The method of claim 15,further comprising: (f) determining a second group of semiconductorcomponents from among the plurality of semiconductor components thatoperate unexpectedly based upon the plurality of performancemeasurements.
 17. The method of claim 13, wherein the plurality ofpredetermined semiconductor component thermograms are assigned to acorresponding indicia of performance from among a plurality of indicesof performance.
 18. The method of claim 17, further comprising: (d)comparing each of the plurality of semiconductor component thermogramsto plurality of predetermined semiconductor component thermograms; and(e) assigning the corresponding indicia of performance that is assignedto a corresponding one of the plurality of predetermined semiconductorcomponent thermograms that closely approximates each of the plurality ofsemiconductor component thermograms.